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Based on the evaporation of the material of the order of μm (micrometres or microns) in the area of the part to engrave using successive repetitions of a laser light beam.
This technique is ideal for engraving:
- Symbols such as: power, EC, electricity, recycling, type of plastic, etc.
- Logotypes
- Figures
- For small electrodes (copper, graphite)
The depth that can be engraved varies:
I. For MARKING it will be several μm (microns)
II. For ENGRAVING it will be of the order of tenths of a millimetre.
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The projection of a PARKING / ENGRAVING can be done in four ways:
• A 2D drawing projected onto a flat surface to give it a specific depth.
• A 2D drawing projected onto a non-flat surface to give it a specific depth or, in other words, a 2D drawing projected onto a 3D object.
• A 3D drawing to project onto a flat surface, normally with the depth or height determined by the 3D drawing.
• A 3D drawing projected onto a non-flat surface or, in other words, 3D projected onto 3D, normally with the depth or height established in the 3D drawing.
ENGRAVING can be done both in NEGATIVE (the drawing to engrave remains inside) or POSITIVE (the drawing to engrave is in relief).
The MARKING / ENGRAVING can be executed on all types of steels, aluminium, copper, graphite, plastics and by-products for both small and large production series.
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